JPH088138Y2 - 半導体の実装構造 - Google Patents

半導体の実装構造

Info

Publication number
JPH088138Y2
JPH088138Y2 JP1987176324U JP17632487U JPH088138Y2 JP H088138 Y2 JPH088138 Y2 JP H088138Y2 JP 1987176324 U JP1987176324 U JP 1987176324U JP 17632487 U JP17632487 U JP 17632487U JP H088138 Y2 JPH088138 Y2 JP H088138Y2
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor element
semiconductor
mounting structure
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987176324U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0180473U (en]
Inventor
和夫 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP1987176324U priority Critical patent/JPH088138Y2/ja
Publication of JPH0180473U publication Critical patent/JPH0180473U/ja
Application granted granted Critical
Publication of JPH088138Y2 publication Critical patent/JPH088138Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987176324U 1987-11-20 1987-11-20 半導体の実装構造 Expired - Lifetime JPH088138Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987176324U JPH088138Y2 (ja) 1987-11-20 1987-11-20 半導体の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987176324U JPH088138Y2 (ja) 1987-11-20 1987-11-20 半導体の実装構造

Publications (2)

Publication Number Publication Date
JPH0180473U JPH0180473U (en]) 1989-05-30
JPH088138Y2 true JPH088138Y2 (ja) 1996-03-06

Family

ID=31468065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987176324U Expired - Lifetime JPH088138Y2 (ja) 1987-11-20 1987-11-20 半導体の実装構造

Country Status (1)

Country Link
JP (1) JPH088138Y2 (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596839U (ja) * 1982-07-07 1984-01-17 日本電気株式会社 半導体装置
JPS6232548U (en]) * 1985-08-14 1987-02-26
JPS62182560U (en]) * 1986-05-12 1987-11-19

Also Published As

Publication number Publication date
JPH0180473U (en]) 1989-05-30

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